2026 晶鏈高峰論壇｜Semicon Network Summit 2026
當 AI 引領下一波科技革命、全球半導體供應鏈迎來重大轉型，我們如何跨越地域與產業界線，共同打造可信任、具韌性的全球半導體合作網絡？這不僅關乎科技競爭，更攸關國家安全、數位信任與全球經濟的未來發展。
為凝聚全球半導體產業創新能量，促進跨國政策與技術對話，由經濟部主辦，工研院與國際半導體產業協會（SEMI）共同執行「2026 晶鏈高峰論壇」。論壇聚焦四大核心議題，包括「打造共榮新局：深化全球可信任的半導體合作網絡」、「光速運算革命：跨國協作建構矽光子與量子生態系」、「打造智慧大腦：AI 機器人時代的晶片新趨勢」，以及「資安韌性奠基：強化全球半導體供應鏈穩定」。論壇將邀集來自全球半導體關鍵國家的政策官員、國際企業領袖及學研專家齊聚臺灣，展開跨國高層政策與產業對話，共同形塑下一世代半導體合作願景，深化全球夥伴關係，攜手打造以「信賴、韌性、共榮」為核心的全球半導體合作新局。
Amid the AI revolution and global semiconductor supply chain shifts, trusted collaboration powers a resilient semiconductor ecosystem that drives innovation, digital resilience, and economic growth.
With this shared commitment, the Ministry of Economic Affairs (MOEA) hosts the Semicon Network Summit 2026, co-organized by the Industrial Technology Research Institute (ITRI) and SEMI, will take place in Taipei, Taiwan, bringing together global semiconductor leaders, policymakers, and research experts to foster high-level cross-border dialogues and advance collaboration.
The summit will feature four key sessions: Building a Shared Future: Deepening the Trusted Global Semiconductor Cooperation Network, Light-Speed Computing: Scaling Silicon Photonics & Quantum Ecosystems, Smart Brains: Next-Gen Chip Trends in AI Robotics, and Cyber Resilience: Stabilizing the Global Semiconductor Supply Chain.
These discussions will enable stakeholders to forge stronger global partnerships, accelerate next-generation semiconductor cooperation, and strengthen a connected network rooted in Trust, Resilience, and Prosperity.
＊主辦單位保有隨時修改及終止本活動之權利，如有任何變更內容或詳細注意事項將公布於本網頁，恕不另行通知。
＊The organizers reserve the right to modify or cancel the event at any time. Any changes or updates will be announced on this website without prior notice.